PHEMT
RF chip is the core component of mobile intelligent terminal products. The pursuit of low power consumption, high performance and low cost is the main driving force for its technology upgrading, mainly including transceiver and RF front-end [such as power amplifier (PA), antenna switch, filter, duplexer and diplexer, low noise amplifier (LNA)].
HEMT
A high current "power brick" power device designed based on gallium nitride (GaN) and silicon carbide (SiC), mainly used in photovoltaic inverters, motor control, new energy vehicles, wireless charging, medium and low voltage fast charging.
AI dynamical-system
Mainly using GaN high electronic transfer programmable power system chips based on artificial intelligence large model architecture, as well as solutions for unmanned aerial vehicles, robot visual tactile sensing, and edge artificial intelligence algorithms. The company's research team has won multiple second and third prizes in the ICCV International Artificial Intelligence Competition for three consecutive years, and won the CVPR championship at the International Computer Vision Tactile Summit in 2024.
Mini LED
The Mini LED display driver chip integrates high-precision constant current control, PWM generation, and digital signal processing components, and is the main part of the display screen imaging system. It is responsible for receiving image data and converting it into PWM constant current drive, accurately controlling the corresponding LED grayscale display. The company currently has large-scale 8K Mini LED display high refresh chips and matrix LED backlight driver chips designed based on CPWM technology. There are also full-color ultra-high brightness LED epitaxy and LED chips.
Micro LED
Micro LED, By miniaturizing and matrixizing LED backlight sources, we are committed to driving inorganic self emission (self emission) separately and extending product lifespan. The length of the Maicro LED chip is about 1-10 μ m, which is only 1% of that of LED. Through large-scale transfer technology, we have achieved μ m level three color RGB Micro LEDs are transferred onto substrates to form various sizes of Micro LED display screens.

AIPS

CT6001

9mm × 9mm × 0.85mm

High performance H.264/HEVC/JPEG encoding

Coder

3 million pixels @ 45 fps



 
CT6002

10mm × 10mm × 0.85mm

High performance H.264/HEVC/JPEG encoding

Coder

8 million pixels @ 24 fps



 
CT6301

BLE SOC BLE 5.1

QFN32 (4mm x 4mm)

32-bit RISC

Maximum operating frequency 64MHz



 
CT-9004A

17mm × 17mm × 2.1mm

Interface: SDIO3.0 × 1; UART × 1;