Develop large-scale AI ASIC integrated chips for artificial intelligence power systems and new display fields based on the characteristic process technology of compound semiconductor gallium nitride (GaN) and gallium oxide (Ga2O3) materials. In February 2025, the company released the world's first "embodied robot power system chip" and simultaneously launched two series of joint control and gallium nitride (GaN) array drivers for commercial use. Obtained multiple invention patents for the AI physical model software solution of "robot motion control". The company's research team has won multiple second and third prizes in the ICCV International Artificial Intelligence Competition for three consecutive years, and won the CVPR championship at the International Robot Vision and Touch Summit in 2024.
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Zhongke Wireless Semiconductor, founded by a team of alumni from the University of Science and Technology of China, has many years of experience in the research and industrialization of compound power semiconductors. It is a high-end analog chip design company based on the research and production of compound materials.
Zhongke Wireless Semiconductor Co., Ltd., abbreviated as "Zhongke Semiconductor", was founded in Hefei in 2011 and moved to Shenzhen, Guangdong in 2018. It is a military civilian integration enterprise founded by a team of alumni from the University of Science and Technology of China. It is composed of expert doctoral supervisors in the field of "third-generation semiconductor" analog chip design, including 7 professors and 11 PhDs. It has obtained 43 national defense and civil patents and has published a total of 250 papers. The team comes from the major military industrial institutes and the Semiconductor Research Institute of the Chinese Academy of Sciences, and has rich experience in compound power semiconductor research and development and industrialization. The chips developed include HEMT, PHEMT, GaN/SiC, Transceiver communication chips mini LED、micro LED、 Development of compound semiconductor epitaxial materials and development of sapphire substrate technology for growing aluminum oxide (AI2O3) materials. The product is mainly used in fields such as new energy, drones, unmanned equipment, Internet of Things, display panels, and fast charging.
Read detailIn 2023, gallium arsenide/gallium nitride HEMT/PHEMT, GaN epitaxy will enter the mass production stage; In 2023, the MiniLED 8-channel chip was verified to be qualified; Develop 48 channel chips; In 2022, SiP process design and mass production of IoT chips and SiP packaging machine image SOC+RFTransceiver will be achieved; Developing photonic microwave connectors in 2019.
Read detailThe company is qualified as a national high-tech enterprise and a national software enterprise. Obtained 100 patents, 9 software copyrights, police probes, transparent algorithm encryption systems, etc., and received government funding (5 million yuan). Awarded as a member of the China Semiconductor Alliance and a partner of Huawei's 4G Smart Antenna and China Mobile's 5G Joint Innovation Center.
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