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Leader in Robotic Powertrain ASIC Chips

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Zhongke Wireless Semiconductor specializes in AI+compound semiconductor technology, focusing on the design and manufacturing of neuromorphic motion control chips for robots and gallium nitride (GaN) integrated circuits. The company primarily pursues the hardwareization of edge multimodal algorithms, the analogization of AI-side ASIC chips, and the R&D training of VLA physical models. It provides enterprises with comprehensive solutions for edge-side neuromorphic Agent motion control chips. Multiple dexterous hand, motion control, and compound sensor chips have achieved large-scale commercialization. The company holds numerous core invention patents in fields such as physical models, materials, devices, and processes, and has won multiple national awards year after year. It secured second and third prizes in the ICCV international AI competition and claimed the top spot at the CVPR international conference on robotics vision and touch in 2024. Driven by breakthroughs in foundational technologies, the company continuously delivers cutting-edge innovations and achievements.

RMC

An intelligent agent (Agent) ASIC motion control high-performance chip based on a robot model control architecture serves as a bridge connecting AI with the physical world, allowing robots to understand the logic behind the world just like humans.

Agt-ACT

Based on gallium nitride (GaN) integrated circuit technology, it achieves high frequency and high efficiency, high power density, low temperature rise, and rapid response, with a junction temperature reaching up to 225 °C. The intelligent joint chip has a built-in FOC algorithm, enabling robot actuators to develop towards lightweight and standardized designs, while addressing long-standing industry challenges in robot joints such as overheating, short battery life, slow response, and bulkiness.

RPS

Gallium nitride (GaN) low-impedance, high-electron-mobility gallium integrated circuits "Specialized AI Power Chip Solution," featuring built-in high-precision SOC, SOH, and SOPAI electron mobility estimation algorithms. Primarily used in embodied robots, aerospace, space robots, smart equipment, and other applications.

RDL

Gallium Nitride (GaN) millimeter-wave and millimeter-wave high electron mobility (PHEMT) amplifier and Transceiver chip solutions, mainly used in applications such as drones, robots, intelligent equipment, air-to-ground communication, space networking, and electronic countermeasures in complex electromagnetic environments.

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About Us

All members of the Zhongke Wireless Semiconductor team are from leading research institutions, with core members consisting of experts and PhDs who have years of experience in compound integrated circuits and robotics AI algorithms. The team boasts extensive expertise in the development of motion control analog computing chips and the industrialization of gallium-based integrated circuits, having successfully launched the world's first robot power system chip and China's first gallium nitride magnetic encoding chip.

Company Overview

The predecessor of Zhongke (Shenzhen) Wireless Semiconductor team was established in Hefei and relocated to Shenzhen in 2018, focusing on the research and development of robot cerebellar motion control chips, GaN (compound semiconductor) integrated circuits, analog computing, and end-to-end AI ASIC chips. At present, the team has achieved large-scale commercial use of multiple chips, with a total of more than 100 patents and 250 papers. The core patents cover the entire AI+simulation computing chain. With the innovation of AI and new material technology, the team has won multiple national level disruptive technology awards and the "China Chip" annual major breakthrough award. It has also won awards in the ICCV International Artificial Intelligence Competition and won the championship in the CVPR Robot Vision and Touch Competition in 2024.

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Development history

Zhongke (Shenzhen) Wireless Semiconductor focuses on the field of AI+compound semiconductor integrated circuits and is deeply involved in the research and development of specialized chips for robot motion control. In 2022, the company's packaging factory was officially put into operation, with a compound annual growth rate of 57.8%; Continuously winning important awards in international artificial intelligence competitions from 2023 to 2024; In 2025, the world's first embodied robot power chip will be released and won multiple national awards; In 2026, the first domestically produced magnetic encoding chip CT-21X will be launched, with a cumulative shipment of over 20 million units. At the same time, it will be landed in the Chongqing manufacturing center, further improving the industrial chain layout of robot motion control dedicated chips.

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Company honors

The company has accumulated over 100 patents and 250 papers, with core patents covering the entire AI+simulation computing chain. With the innovation of AI and new material technology, the team has won multiple national level disruptive technology awards and the "China Chip" annual major breakthrough award. It has also won awards in the ICCV International Artificial Intelligence Competition and won the championship in the CVPR Robot Vision and Touch Competition in 2024. In 2025, the company will launch the world's first robot motion control chip; In 2026, the first domestically produced magnetic encoding chip CT-21X will be launched.

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