RMC
Released the world's first dedicated cerebellar chip solution that constrains AI model physical quantity outputs, with perception → decision → execution delay under 5ms, high-frequency neural reflexes exceeding 250Hz, and motion control models winning second and third prizes at the ICCV International AI Competition, and the CVPR International AI Vision and Tactile Championship in 2024.
Agt-ACT
The intelligent joint chip is equipped with a built-in FOC algorithm, using motor field-oriented control technology implemented through analog circuits. It has no operating system and operates at temperatures below 170°C. We achieved integration of 5,000 HEMT devices on a GaN two-dimensional electron device, with an operating temperature below 250°C. The joint motor driver chip integrates six HEMTs on a single chip, offering higher efficiency and smaller size.
RDP
Gallium Nitride (GaN) low-impedance, high electron mobility gallium integrated circuit 'digital power chip solution,' with built-in high-precision SOC, SOH, SOP AI electron mobility estimation algorithms. It is mainly used in aerospace, space robotics, smart equipment, digital inverters, new energy vehicles, new energy battery BMS management, safe charging, and other scenarios.
RDL
Gallium Nitride (GaN) millimeter-wave and millimeter-wave high electron mobility (PHEMT) amplifier and Transceiver chip solutions, mainly used in applications such as drones, robots, intelligent equipment, air-to-ground communication, space networking, and electronic countermeasures in complex electromagnetic environments.

Agt-ACT

CT-1902

5mm×6.5mm LGA-30pin

2 x GaN HEMT+1 x Half Bridge Driver

Suitable for lightweight application scenarios



 
CT-1906

CT-1906 V1.1 is a 100V, 60A three-phase enhanced gallium nitride half bridge chip, packaged in a 10 × 10mm LGA. This package integrates 6 high-performance HEMT devices and 3 driver chips, making it the most compact and efficient GaN solution in the industry.


 
CT1908

CT-1908 is a 100V, 150A half bridge SolidGaN in a compact 9mm × 9mm LGA package. The package includes six high-performance enhanced GaN FETs, drivers, gate resistors, and driver power capacitors, providing the industry's most compact and efficient GaN power solution. 


 
CT-1904

8mm×8mm LGA-15pin

6×GaN HEMT 

Suitable for high-performance robotic actuators



 
CT6910

The CT6910 chip supports floating-point operations and DSP instructions, featuring up to 1MB of on-chip Flash, 512KB of SRAM, and integrates up to 8 high-performance analog devices. It includes 21 digital communication interfaces and over 10 built-in cryptographic algorithm hardware acceleration engines, supporting various security features such as secure storage, user partition protection, and secure boot.


 
CT6912E

The CT6912E chip supports floating-point operations and DSP instructions, with up to 1MB of on-chip Flash and 512KB of SRAM. It integrates up to 8 high-performance analog devices, 21 digital communication interfaces, and more than 10 hardware acceleration engines for password algorithms. It supports multiple security features such as storage encryption, user partition protection, and secure boot.